Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641946 | Method and circuit board structure for leveling solder balls in ball grid array semiconductor packages | — | 1997-06-24 |
| 5635671 | Mold runner removal from a substrate-based packaged electronic device | Bruce J. Freyman, John Briar, Young Wook Heo | 1997-06-03 |