Issued Patents 1997
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702985 | Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method | — | 1997-12-30 |
| 5654877 | Lead-on-chip integrated circuit apparatus | — | 1997-08-05 |
| 5644161 | Ultra-high density warp-resistant memory module | — | 1997-07-01 |
| 5631193 | High density lead-on-package fabrication method | — | 1997-05-20 |
| 5615475 | Method of manufacturing an integrated package having a pair of die on a common lead frame | — | 1997-04-01 |
| 5605592 | Method of manufacturing a bus communication system for stacked high density integrated circuit packages | — | 1997-02-25 |