HF

Hiroyuki Fukasawa

SO Sony: 1 patents #385 of 1,361Top 30%
Overall (1997): #142,509 of 185,788Top 80%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5650177 Resin molding apparatus Akira Kojima, Tsuneyuki Hayashi, Takashi Saito 1997-07-22