Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5654590 | Multichip-module having an HDI and a temporary supporting substrate | — | 1997-08-05 |
| 5633532 | Semiconductor device interconnection | Tuyosi Sohara, Hirohisa Matsuki | 1997-05-27 |