Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5648687 | Resin for sealing compound semiconductor, semiconductor device, and process for manufacturing it | Yoshihiko Matsuo, Naoki Sata, Toshihumi Yoshikawa, Tsuneo Matsumura | 1997-07-15 |