Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5700721 | Structure and method for metallization of semiconductor devices | Hank Hukyoo Shin, Clarence J. Tracy, Robert L. Duffin, John L. Freeman, Jr., Syd R. Wilson | 1997-12-23 |
| 5667632 | Method of defining a line width | Richard S. Burton | 1997-09-16 |
| 5650356 | Method for reducing corrosion in openings on a semiconductor wafer | Gregory W. Grynkewich, Thomas S. Roche | 1997-07-22 |
| 5641712 | Method and structure for reducing capacitance between interconnect lines | Karl J. Johnson, Bruce Bernhardt | 1997-06-24 |