Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5695810 | Use of cobalt tungsten phosphide as a barrier material for copper metallization | Valery M. Dubin, Yosi Schacham-Diamand, Bin Zhao, Chiu H. Ting | 1997-12-09 |
| 5674787 | Selective electroless copper deposited interconnect plugs for ULSI applications | Bin Zhao, Valery M. Dubin, Yosef Shacham-Diamand, Chiu H. Ting | 1997-10-07 |
| 5660706 | Electric field initiated electroless metal deposition | Bin Zhao | 1997-08-26 |