SL

Sang-Hyuk Lee

Samsung: 1 patents #190 of 955Top 20%
📍 Anyang-si, NY: #1 of 2 inventorsTop 50%
Overall (1997): #81,173 of 185,788Top 45%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5684330 Chip-sized package having metal circuit substrate — 1997-11-04