Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5684328 | Semiconductor chip package using improved tape mounting | Ho Jin, Chang Eui Ko | 1997-11-04 |
| 5633206 | Process for manufacturing lead frame for semiconductor package | Sang Hoon Kim, Sung-Min Sim, Sang-Gil Lee | 1997-05-27 |