Issued Patents 1997
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5703599 | Injection molded offset slabline RF feedthrough for active array aperture interconnect | Peter J. Holbrook, Bill Batterton, Pat Fitzgerald, Dan Roper, Min Takaki | 1997-12-30 |
| 5675302 | Microwave compression interconnect using dielectric filled three-wire line with compressible conductors | Claudio S. Howard, Rick Sturdivant, John J. Wooldridge | 1997-10-07 |
| 5668509 | Modified coaxial to GCPW vertical solderless interconnects for stack MIC assemblies | Richard Hoffmeister | 1997-09-16 |
| 5638033 | Three port slot line circulator | Lonny R. Walker | 1997-06-10 |
| 5633615 | Vertical right angle solderless interconnects from suspended stripline to three-wire lines on MIC substrates | — | 1997-05-27 |
| 5631446 | Microstrip flexible printed wiring board interconnect line | — | 1997-05-20 |