Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5698904 | Packaging material for electronic components | — | 1997-12-16 |
| 5672550 | Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame | Osamu Miyata | 1997-09-30 |
| 5619312 | Developing device with developer-supplying mechanism | Shintarou Hatano, Hiroshi Kawahito, Yoshiki Ichikawa, Fumito Mizoguti, Takao Hiroyasu +5 more | 1997-04-08 |