Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686509 | Epoxy resin structural adhesive composition | Akira Nakayama, Toshio Nagase, Masahiko Ohnishi | 1997-11-11 |
| 5634093 | Method and CAD system for designing wiring patterns using predetermined rules | Yoshiei Endou | 1997-05-27 |