Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5652157 | Forming a gate electrode on a semiconductor substrate by using a T-shaped dummy gate | Makoto Hirano, Kazuyoshi Asai, Yuhki Imai, Masami Tokumitsu, Tsuneo Tokumitsu | 1997-07-29 |
| 5639686 | Method of fabricating circuit elements on an insulating substrate | Makoto Hirano, Kazuyoshi Asai, Yuhki Imai, Masami Tokumitsu, Tsuneo Tokumitsu | 1997-06-17 |
| 5634208 | Multilayer transmission line using ground metal with slit, and hybrid using the transmission line | Kenjiro Nishikawa, Tsuneo Tokumitsu, Kenji Kamogawa | 1997-05-27 |