Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5687901 | Process and apparatus for forming ball bumps | Hiroshi Hoshiba, Masashi Konda, Yoji Kawakami | 1997-11-18 |
| 5639558 | Insulating resin-coated bonding wire | Hiroyuki Kondo, Michio Nitta, Shinya Nariki | 1997-06-17 |