Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5677393 | Heat-resistant film adhesive for use in fabrication of printed circuit boards and process for using the same | Yukihiro Wada, Masatoshi Yuasa, Keiichirou Wada, Makoto Shimose, Kenji Nakajima +1 more | 1997-10-14 |