NS

Naoji Senba

NE Nec: 1 patents #225 of 1,182Top 20%
📍 Tokyo, MO: #31 of 51 inventorsTop 65%
Overall (1997): #99,628 of 185,788Top 55%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5600180 Sealing structure for bumps on a semiconductor integrated circuit chip Teruo Kusaka, Atsushi Nishizawa, Nobuaki Takahashi 1997-02-04