Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5606199 | Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame | — | 1997-02-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5606199 | Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame | — | 1997-02-25 |