Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686842 | Known good die test apparatus and method | — | 1997-11-11 |
| 5652185 | Maximized substrate design for grid array based assemblies | — | 1997-07-29 |
| 5620927 | Solder ball attachment machine for semiconductor packages | — | 1997-04-15 |
| 5620928 | Ultra thin ball grid array using a flex tape or printed wiring board substrate and method | Anthony E. Panczak, Jagdish G. Belani | 1997-04-15 |