Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5607873 | Method for forming contact openings in a multi-layer structure that reduces overetching of the top conductive structure | Hung-Sheng Chen, Tim Nguyen, Chih Sieh Teng | 1997-03-04 |