Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5690749 | Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material | — | 1997-11-25 |
| 5623166 | Al-Ni-Cr conductive layer for semiconductor devices | Johnson O. Olowolafe, Hisao Kawasaki | 1997-04-22 |
| 5593919 | Process for forming a semiconductor device including conductive members | Hisao Kawasaki | 1997-01-14 |