Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5654588 | Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure | Edward C. Dasse, Robert W. Bollish, James H. Carlquist, Thomas R. Yarbrough, Charles F. Toewe +5 more | 1997-08-05 |