SM

Shuichi Matsuda

NE Nec: 1 patents #225 of 1,182Top 20%
📍 Kashiwa, JP: #12 of 53 inventorsTop 25%
Overall (1997): #78,280 of 185,788Top 45%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5683942 Method for manufacturing bump leaded film carrier type semiconductor device Keiichiro Kata, Eiji Hagimoto 1997-11-04