Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5645864 | Resin encapsulating molding die for manufacturing a semiconductor device | — | 1997-07-08 |
NH
Noriaki Higuchi
Overall (1997): #98,390 of 185,788Top 55%
1
Patents 1997