Issued Patents 1997
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5693981 | Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system | Joseph Joroski | 1997-12-02 |
| 5654587 | Stackable heatsink structure for semiconductor devices | Joseph Joroski | 1997-08-05 |
| 5644143 | Method for protecting a semiconductor device with a superconductive line | Michael D. Rostoker, Nicholas F. Pasch, Abraham Yee, William C. Schneider | 1997-07-01 |
| 5639696 | Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array | Dexin Liang | 1997-06-17 |
| 5610442 | Semiconductor device package fabrication method and apparatus | Robert T. Trabucco | 1997-03-11 |
| 5593918 | Techniques for forming superconductive lines | Michael D. Rostoker, Nicholas F. Pasch, Abraham Yee, William C. Schneider | 1997-01-14 |