Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686764 | Flip chip package with reduced number of package layers | — | 1997-11-11 |
| 5648661 | Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies | Michael D. Rostoker, Carlos Dangelo, James S. Koford | 1997-07-15 |