Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5635424 | High-density bond pad layout arrangements for semiconductor dies, and connecting to the bond pads | Michael D. Rostoker | 1997-06-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5635424 | High-density bond pad layout arrangements for semiconductor dies, and connecting to the bond pads | Michael D. Rostoker | 1997-06-03 |