Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5643835 | Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs | Seng-Sooi Lim | 1997-07-01 |
| 5594626 | Partially-molded, PCB chip carrier package for certain non-square die shapes | Michael D. Rostoker, Seng-Sooi Lim | 1997-01-14 |