Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5652184 | Method of manufacturing a thin semiconductor package having many pins and likely to dissipate heat | Morihiko Ikemizu | 1997-07-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5652184 | Method of manufacturing a thin semiconductor package having many pins and likely to dissipate heat | Morihiko Ikemizu | 1997-07-29 |