Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5668247 | Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires | Hiroyuki Furutani, Kazuhisa Danno, Yoshifumi Okamoto, Junya Ida, Yoshihide Oonari +1 more | 1997-09-16 |
| 5665802 | Polyimide film and manufacturing method thereof | Haruhiko Maki, Yoshiaki Inaba | 1997-09-09 |
| 5641852 | Thermosetting resin composition and method of manufacturing it from an epoxy resin, cyanate and phenol | Hiroyuki Tsuji, Shoji Hara | 1997-06-24 |
| 5621068 | Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminate | Yoshifumi Okamoto, Hiroyuki Furutani, Kazuhisa Danno, Junya Ida | 1997-04-15 |