Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5703397 | Semiconductor package having an aluminum nitride substrate | Mitsuyoshi Endo, Hironori Asai, Keiichi Yano | 1997-12-30 |
| 5698896 | High thermal conductive silicon nitride structural member, semiconductor package, heater and thermal head | Michiyasu Komatsu, Katsuhiro Shinosawa, Mineyuki Yamaga | 1997-12-16 |