Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641997 | Plastic-encapsulated semiconductor device | Hideo Ohta, Tetsuo Okuyama, Sadao Kajiura, Akira Yoshizumi | 1997-06-24 |
| 5637667 | Thermosetting resin composition | Hiroshi Shimozawa, Shuzi Hayase, Yoshihiko Nakano, Akira Yoshizumi, Ken Uchida | 1997-06-10 |