Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5614441 | Process of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated package | Ryuji Hosokawa | 1997-03-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5614441 | Process of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated package | Ryuji Hosokawa | 1997-03-25 |