Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641718 | Sintered aluminum nitride and circuit substrate using sintered aluminum nitride | Akihiro Horiguchi, Mitsuo Kasori, Hiroyasu Sumino, Fumio Ueno, Jun Monma +1 more | 1997-06-24 |
| 5622769 | Ceramic circuit board having a thermal conductivity substrate | Shoji Kozuka, Masaru Hayashi, Takaaki Yasumoto, Nobuo Iwase, Hiroshi Endo +3 more | 1997-04-22 |
| 5616956 | Circuit substrate including insulating layer of aluminum nitride and electrically conductive layer of conductive component, aluminum nitride and other components, and semiconductor device containing same | Akihiro Horiguchi, Jun Monma, Kazuo Kimura, Fumio Ueno, Mitsuo Kasori +1 more | 1997-04-01 |