Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5688721 | 3D stack of IC chips having leads reached by vias through passivation covering access plane | — | 1997-11-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5688721 | 3D stack of IC chips having leads reached by vias through passivation covering access plane | — | 1997-11-18 |