Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5615089 | BGA semiconductor device including a plurality of semiconductor chips located on upper and lower surfaces of a first substrate | Yoshihiro Yoneda | 1997-03-25 |
| 5592735 | Method of making a multi-chip module having an improved heat dissipation efficiency | Haruo Sorimachi | 1997-01-14 |