Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5633069 | Multilayer printed-circuit substrate, wiring substrate and process of producing the same | Hiroshi Shimamura, Hidetaka Kumota | 1997-05-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5633069 | Multilayer printed-circuit substrate, wiring substrate and process of producing the same | Hiroshi Shimamura, Hidetaka Kumota | 1997-05-27 |