Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5621615 | Low cost, high thermal performance package for flip chips with low mechanical stress on chip | Peter F. Dawson, Voddarahalli K. Nagesh | 1997-04-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5621615 | Low cost, high thermal performance package for flip chips with low mechanical stress on chip | Peter F. Dawson, Voddarahalli K. Nagesh | 1997-04-15 |