BP

Benedict G. Pace

📍 Smithtown, NY: #4 of 31 inventorsTop 15%
🗺 New York: #1,999 of 7,187 inventorsTop 30%
Overall (1997): #172,970 of 185,788Top 95%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5627406 Inverted chip bonded module with high packaging efficiency — 1997-05-06