Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5660321 | Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts | Kenzo Ishida, Kinya Ichikawa | 1997-08-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5660321 | Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts | Kenzo Ishida, Kinya Ichikawa | 1997-08-26 |