Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5679982 | Barrier against metal diffusion | — | 1997-10-21 |
| 5654232 | Wetting layer sidewalls to promote copper reflow into grooves | — | 1997-08-05 |
| 5612254 | Methods of forming an interconnect on a semiconductor substrate | Xiao-Chun Mu, Srinivasan Sivaram, David B. Fraser | 1997-03-18 |