Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5673177 | Heat sink structure with corrugated wound wire heat conductive elements | William L. Brodsky, Glenn L. Kehley | 1997-09-30 |
| 5654876 | Demountable heat sink | Pratap Singh | 1997-08-05 |
| 5604445 | Apparatus, and corresponding method, for stress testing semiconductor chips | Kishor Desai, Maganlal S. Patel | 1997-02-18 |