Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5633533 | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | Frank E. Andros, James R. Bupp, Richard B. Hammer | 1997-05-27 |