Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5651493 | Method of performing solder joint analysis of semi-conductor components | James D. Bielick, Phillip Duane Isaacs | 1997-07-29 |
| 5632438 | Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization | Gregg A. Knotts, Connie Jean Mathison | 1997-05-27 |
| 5601675 | Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor | David Allen Sluzewski | 1997-02-11 |