Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5699613 | Fine dimension stacked vias for a multiple layer circuit board structure | Ku Ho Chong, Charles H. Crockett, Jr., Stephen Alan Dunn, deceased, Michael G. McMaster | 1997-12-23 |
| 5675889 | Solder ball connections and assembly process | John Acocella, Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, John Saunders Corbin, Jr. +1 more | 1997-10-14 |
| 5591941 | Solder ball interconnected assembly | John Acocella, Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, David P. Watson +1 more | 1997-01-07 |