JW

James Warren Wilson

IBM: 2 patents #396 of 3,557Top 15%
📍 Vestal, NY: #7 of 44 inventorsTop 20%
🗺 New York: #838 of 7,187 inventorsTop 15%
Overall (1997): #36,553 of 185,788Top 20%
2
Patents 1997

Issued Patents 1997

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5661089 Method for making a semiconductor chip package with enhanced thermal conductivity — 1997-08-26
5616958 Electronic package Eric H. Laine 1997-04-01