JV

Jack A. Varcoe

IBM: 1 patents #1,061 of 3,557Top 30%
📍 Endwell, NY: #12 of 34 inventorsTop 40%
🗺 New York: #1,999 of 7,187 inventorsTop 30%
Overall (1997): #133,955 of 185,788Top 75%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5669137 Method of making electronic package assembly with protective encapsulant material James V. Ellerson, Richard Joseph Noreika 1997-09-23