Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5672548 | Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy | Thomas M. Culnane, Michael A. Gaynes, Ping Kwong Seto | 1997-09-30 |
| 5639694 | Method for making single layer leadframe having groundplane capability | Steven Joel Diffenderfer | 1997-06-17 |