Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5676788 | Method for forming cavity structures using thermally decomposable surface layer | Niranjan M. Patel, Kurt A. Smith | 1997-10-14 |
| 5665195 | Apparatus for forming cavities without using an insert | Raschid J. Bezama, John U. Knickerbocker | 1997-09-09 |
| 5655213 | Co-sintered surface metallization for pin-join, wire-bond and chip attach | Srinivasa S. N. Reddy | 1997-08-05 |
| 5639562 | Co-sintered surface metallization for pin-join, wire-bond and chip attach | Srinivasa S. N. Reddy | 1997-06-17 |
| 5613181 | Co-sintered surface metallization for pin-join, wire-bond and chip attach | Srinivasa S. N. Reddy | 1997-03-18 |