DW

David W. Wang

IBM: 6 patents #40 of 3,557Top 2%
📍 Hsinchu, CT: #1 of 1 inventorsTop 100%
Overall (1997): #2,856 of 185,788Top 2%
6
Patents 1997

Issued Patents 1997

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
5668059 Solder interconnection structure and process for making Frederick R. Christie, Kostas Papathomas 1997-09-16
5665526 Thermally stable photoimaging composition Voya R. Markovich, Ashit A. Mehta, Eugene R. Skarvinko 1997-09-09
5656862 Solder interconnection structure Kostas Papathomas 1997-08-12
5614250 Coated filler and use thereof Carl E. Diener, Ashit A. Mehta, Ralph S. Paonessa, Eugene R. Skarvinko 1997-03-25
5607744 Coated filler and use thereof Carl E. Diener, Ashit A. Mehta, Ralph S. Paonessa, Eugene R. Skarvinko 1997-03-04
5605781 Photosensitive composition with cyanate esters and use thereof Jeffrey D. Gelorme, Eugene R. Skarvinko 1997-02-25