Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5677569 | Semiconductor multi-package stack | Ki-Won Choi, Seung-Kon Mok | 1997-10-14 |
| 5625221 | Semiconductor assembly for a three-dimensional integrated circuit package | Jae June Kim, Dong Kwan Kim | 1997-04-29 |
| 5621242 | Semiconductor package having support film formed on inner leads | Seung-Kon Mok, Gu-Sung Kim | 1997-04-15 |
| 5594275 | J-leaded semiconductor package having a plurality of stacked ball grid array packages | Young-Shin Kwon | 1997-01-14 |